Patent · US Active

Connector assembly and method of manufacture

US8449339B2 · kind B2 · utility

3Cited by

27References

19Claims

0Family size

Assignee

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

Shutesh Krishnan · Seremban, MY
Soon Wei WANG · Seremban, MY

Key dates

Filing date	Nov 18, 2010
Grant date	May 28, 2013
Priority date	—
Expiry date	Nov 18, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.