Device and method for separating a substrate from a carrier substrate
US8449716B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2010 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Mar 31, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.