Light emitting package structure
US8450770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2010 |
| Grant date | May 28, 2013 |
| Priority date | — |
| Expiry date | Jan 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
Abstract
A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.