Patent · US Active

Die stacking, testing and packaging for yield

US8451014B2 · kind B2 · utility

9Cited by
9References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 2, 2010
Grant dateMay 28, 2013
Priority date—
Expiry dateSep 8, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/16225
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method to test and package dies so as to increase overall yield is provided. The method includes performing a wafer test on a first die and mounting the first die on a package substrate to form a partial package, if the wafer test of the first die is successful. The method further includes performing a system test on the partial package including the first die and stacking a second die on the first die if the system test on the partial package and the first die is successful.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.