Bryan Black
26Patents
9h-index
18Co-inventors
68Inventor score
Filing activity: Apr 28, 2008 → Oct 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8691626B2 | Semiconductor chip device with underfill | Electricity | 19 | Active |
| US8193039B2 | Semiconductor chip with reinforcing through-silicon-vias | Electricity | 15 | Active |
| US8472190B2 | Stacked semiconductor chip device with thermal management | Electricity | 14 | Active |
| US8034662B2 | Thermal interface material with support structure | Electricity | 12 | Active |
| US8338961B2 | Semiconductor chip with reinforcing through-silicon-vias | Electricity | 11 | Active |
| US9437561B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 9 | Active |
| US8866276B2 | Semiconductor chip device with polymeric filler trench | Electricity | 9 | Active |
| US8451014B2 | Die stacking, testing and packaging for yield | Electricity | 9 | Active |
| US9385055B2 | Stacked semiconductor chips with thermal management | Electricity | 9 | Active |
| US8909840B2 | Data bus inversion coding | Emerging Cross-Sectional Technologies | 7 | Active |
| US9806014B2 | Interposer with beyond reticle field conductor pads | Electricity | 6 | Active |
| US8726139B2 | Unified data masking, data poisoning, and data bus inversion signaling | Emerging Cross-Sectional Technologies | 6 | Active |
| US7631439B2 | Reference chart apparatus | Physics | 5 | Active |
| US8704353B2 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Electricity | 4 | Active |
| US8574965B2 | Semiconductor chip device with liquid thermal interface material | Electricity | 4 | Active |
| US8394672B2 | Method of manufacturing and assembling semiconductor chips with offset pads | Electricity | 4 | Active |
| US8617926B2 | Semiconductor chip device with polymeric filler trench | Electricity | 3 | Active |
| US8796842B2 | Stacked semiconductor chip device with thermal management circuit board | Electricity | 2 | Active |
| US9793239B2 | Semiconductor workpiece with selective backside metallization | Electricity | 1 | Active |
| US11602406B1 | System and method for rapidly accessing an improved tourniquet | Human Necessities | 1 | Active |
| US11469212B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 0 | Active |
| US9627281B2 | Semiconductor chip with thermal interface tape | Electricity | 0 | Active |
| US9263364B2 | Thermal interface material with support structure | Electricity | 0 | Active |
| US10842501B2 | System and method for rapidly accessing an improved tourniquet | Human Necessities | 0 | Active |
| US12094853B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.