Integrated antennas in wafer level package

US8451618B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Josef Boeck · Putzbrunn, DE
• Rudolf Lachner · Ingolstadt, DE
• Maciej Wojnowski · Munich, DE
• Thorsten Meyer · Regensburg, DE

Key dates

• Filing date: Oct 28, 2010
• Grant date: May 28, 2013
• Expiry date: Oct 28, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/3436
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. In particular, the semiconductor module comprises a bonding interconnect structure configured to connect an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.