Method and system for sealing a first assembly to a second assembly of a processing system
US8454749B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Jun 4, 2013 |
| Priority date | — |
| Expiry date | Nov 5, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T70/5765
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method, computer readable medium, and system for vapor deposition on a substrate that maintain a first assembly of the vapor deposition system at a first temperature, maintain a second assembly of the vapor deposition system at a reduced temperature lower than the first temperature, dispose the substrate in a process space of the first assembly that is vacuum isolated from a transfer space in the second assembly, and deposit a material on the substrate. As such, the system includes a first assembly having a process space configured to facilitate material deposition, a second assembly coupled to the first assembly and having a transfer space to facilitate transfer of the substrate into and out of the deposition system, a substrate stage connected to the second assembly and configured to support the substrate, and a sealing assembly configured to separate the process space from the transfer space. The first assembly is configured to be maintained at a first temperature and the second assembly is configured to be maintained at a reduced temperature lower than the first temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.