Patent · US Active

Methods of processing and inspecting semiconductor substrates

US8460946B2 · kind B2 · utility

1Cited by

5References

20Claims

0Family size

Assignees

Nanda Technologies GmbH · DE
IMEC · BE

Inventors

Lars Markwort · Haimhausen, DE
Pierre-Yves Guittet · Veldhoven, NL
Sandip Halder · Bierbeek, BE
Anne Jourdain · Leuven, BE

Key dates

Filing date	Apr 18, 2011
Grant date	Jun 11, 2013
Priority date	—
Expiry date	Apr 18, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/9505
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method of inspecting a semiconductor substrate having a back surface and including at least one piece of metal embedded in the substrate comprises directing measuring light towards the back surface of the substrate and detecting a portion of the measuring light received back from the substrate. The method also includes determining a distance between the piece of metal and the back surface based upon the detected measuring light received back from the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.