Semiconductor device and semiconductor package having the same
US8466553B2 · kind B2 · utility
5Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device and a semiconductor package having the same. The semiconductor device includes a conductive element. The conductive element is disposed on a protruded conductive via and liner, and covers a sidewall of the liner. Whereby, the conductive element can protect the protruded conductive via and liner from being damaged. Further, the size of the conductive element is large, thus it is easy to perform a probe test process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.