Substrate treatment method, computer storage medium and substrate treatment apparatus
US8469614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Nov 4, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure is a substrate treatment method of supplying a surface treatment liquid onto a surface of a substrate having a film with high water repellency formed thereon, the method including: a liquid puddle forming step of forming a liquid puddle of the surface treatment liquid by supplying the surface treatment liquid from a nozzle to one location of a peripheral portion of the substrate; and a liquid puddle moving step of then moving the liquid puddle formed at the peripheral portion of the substrate to a central portion of the substrate by moving the nozzle from a position above the peripheral portion of the substrate to a position above the central portion of the substrate while continuing the supply of the surface treatment liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.