Low softening point glass composition, bonding material using same and electronic parts
US8470723B2 · kind B2 · utility
16Cited by
1References
19Claims
0Family size
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Key dates
| Filing date | Jan 14, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Dec 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.