Methodologies and test configurations for testing thermal interface materials

US8471575B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Dustin M. Fregeau · South Burlington, US
• David L. Gardell · Saint Albans, US
• Laura L. Kosbar · Potsdam, US
• Keith C. Stevens · Saint Albans, US
• Grant Wagner · Jericho, US

Key dates

• Filing date: Apr 30, 2010
• Grant date: Jun 25, 2013
• Expiry date: Jun 26, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2874
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.