Methods for fabricating sensor device package using a sealing structure
US8476087B2 · kind B2 · utility
10Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2011 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Apr 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.