Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
US8482139B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2009 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Nov 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.