Substrate holding apparatus, polishing apparatus, and polishing method
US8485866B2 · kind B2 · utility
6Cited by
38References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2012 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Aug 16, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.