Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device
US8490857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2012 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Mar 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.