Three-dimensional network in CMP pad
US8491360B2 · kind B2 · utility
1Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2008 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Feb 8, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.