IC having viabar interconnection and related method
US8492268B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Mar 2, 2012 |
| Grant date | Jul 23, 2013 |
| Priority date | — |
| Expiry date | Mar 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.