Patent · US Active

Stacked interconnect heat sink

US8492911B2 · kind B2 · utility

26Cited by

4References

7Claims

0Family size

Assignee

LSI · US

Inventors

Mark A. Bachman · Sinking Spring, US
John W. Osenbach · Kutztown, US
Sailesh Mansinh Merchant · Orlando, US

Key dates

Filing date	Jul 20, 2010
Grant date	Jul 23, 2013
Priority date	—
Expiry date	Sep 30, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.