Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element
US8497544B2 · kind B2 · utility
3Cited by
7References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2012 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | Jun 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory module includes multiple memory devices mounted to a substrate and one or more discrete heating elements disposed in thermal contact with the memory devices. Each of the memory devices includes charge-storing memory cells subject to operation-induced defects that degrade ability of the memory cells to store data. The discrete heating elements, or single discrete heating element, heats the memory devices to a temperature that anneals the defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.