Method and apparatus for preventing catastrophic contact failure in ultra high temperature piezoresistive sensors and transducers
US8497757B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2010 |
| Grant date | Jul 30, 2013 |
| Priority date | — |
| Expiry date | May 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts. The use of a lead free glass frit prevents catastrophic failure of the piezoresistive sensor and associated transducer in ultra high temperature applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.