Patent · US Active

Direct-write wafer level chip scale package

US8501543B1 · kind B1 · utility

11Cited by
371References
20Claims
0Family size

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Key dates

Filing dateMay 16, 2012
Grant dateAug 6, 2013
Priority date—
Expiry dateMay 16, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.