Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor

US8502224B2 · kind B2 · utility

Assignee

• Industrial Technology Research Institute · TW

Inventors

• Ra-Min Tain · Hengshan, TW
• John Hon-Shing Lau · Taoyuan, TW
• Ming-Che Hsieh · Beijing, CN
• Wei Li · Espoo, FI
• Ming-Ji Dai · Hsinchu, TW

Key dates

• Filing date: Dec 8, 2010
• Grant date: Aug 6, 2013
• Expiry date: Nov 30, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16145
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface.