De-skewed multi-die packages
US8502390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2011 |
| Grant date | Aug 6, 2013 |
| Priority date | — |
| Expiry date | Nov 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.