Integrated circuit package system with shield
US8507319B2 · kind B2 · utility
13Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2007 |
| Grant date | Aug 13, 2013 |
| Priority date | — |
| Expiry date | Dec 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes: forming a first lead and a second lead; connecting an integrated circuit die with the first lead; forming an encapsulation over the integrated circuit die, the first lead, and the second lead with a portion of a top side of the second lead exposed; and forming a shield over the encapsulation, the first lead, and the second lead with the shield not in contact with the first lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.