Patent · US Active

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

US8507320B2 · kind B2 · utility

9Cited by

8References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Henrik Ewe · Burglengenfeld, DE
Klaus Schiess · Allensbach, DE
Manfred Mengel · Bad Abbach, DE

Key dates

Filing date	Mar 18, 2008
Grant date	Aug 13, 2013
Priority date	—
Expiry date	Feb 26, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One aspect is a method including providing a carrier having a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face of the first insulating layer to a second face of the first insulating layer; attaching at least two semiconductor chips to the carrier; applying a second insulating layer over the carrier; opening the second insulating layer until the carrier is exposed; depositing a metal layer over the opened second insulating layer; and separating the at least two semiconductor chips after depositing the metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.