Patent · US Active

Semiconductor package with integrated inductor

US8513771B2 · kind B2 · utility

5Cited by

32References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Horst Theuss · Wenzenbach, DE
Georg Meyer-Berg · Birkenfeld, DE

Key dates

Filing date	Jun 7, 2010
Grant date	Aug 20, 2013
Priority date	—
Expiry date	May 17, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/12105
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.