Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
US8519517B2 · kind B2 · utility
0Cited by
41References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2011 |
| Grant date | Aug 27, 2013 |
| Priority date | — |
| Expiry date | Dec 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.