Patent · US Active

Brace for wire bond

US8524529B2 · kind B2 · utility

0Cited by

8References

13Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Meiquan Huang · Tianjin, CN
Hejin Liu · Tianjin, CN
Hanmin Zhang · Tianjin, CN

Key dates

Filing date	Jun 28, 2011
Grant date	Sep 3, 2013
Priority date	—
Expiry date	Dec 15, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.