Hejin Liu
5Patents
2h-index
9Co-inventors
36Inventor score
Filing activity: Jul 6, 2010 → Nov 26, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8288847B2 | Dual die semiconductor package | Electricity | 3 | Active |
| US8496158B2 | Method and apparatus for monitoring free air ball (FAB) formation in wire bonding | Electricity | 2 | Active |
| US8907464B2 | Helix substrate and three-dimensional package with same | Emerging Cross-Sectional Technologies | 1 | Active |
| US9209119B1 | Semiconductor device assembled using two lead frames | Electricity | 0 | Active |
| US8524529B2 | Brace for wire bond | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.