Semiconductor chip assembly with post/base heat spreader with thermal via
US8525214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2011 |
| Grant date | Sep 3, 2013 |
| Priority date | — |
| Expiry date | Oct 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, an adhesive and a support layer. The heat spreader includes a post, a base, an underlayer and a thermal via. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post, the support layer is sandwiched between the base and the underlayer and the thermal via extends from the base through the support layer to the underlayer. The conductive trace provides signal routing between the pad and the terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.