Integrated circuit packaging system with package on package support and method of manufacture thereof
US8530277B2 · kind B2 · utility
4Cited by
21References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2011 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Oct 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting a die over the substrate; mounting an interposer having a slot over the die; covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant; and forming a hole through the first encapsulant to expose a peripheral portion of the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.