Removal of charge between a substrate and an electrostatic clamp
US8531814B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2010 |
| Grant date | Sep 10, 2013 |
| Priority date | — |
| Expiry date | Apr 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional low resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate 114, the problem whereby the substrate sticks to the clamp can be reduced. This results in a corresponding reduction in substrate breakage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.