Patent · US Active

Supply voltage or ground connections including bond pad interconnects for integrated circuit device

US8531849B1 · kind B1 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Mostafa Naguib Abdulla · Rancho Cordova, US
Steven Eskildsen · Boise, US

Key dates

Filing date	Mar 31, 2010
Grant date	Sep 10, 2013
Priority date	—
Expiry date	May 4, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.