Light emitting diode (LED) package and method
US8535961B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a light emitting diode (LED) package includes mounting a LED structure to a carrier, overmolding the LED structure in a package body, backgrinding the package body to expose the LED structure, removing the carrier, and forming a redistribution layer (RDL) buildup structure comprising a RDL circuit pattern coupled to a LED of the LED structure. The LED package is formed without a substrate in one embodiment. By forming the LED package without a substrate, the thickness of the LED package is minimized. Further, by forming the LED package without a substrate, heat removal from the LED is maximized as is electrical performance. Further still, by forming the LED package without a substrate, the fabrication cost of the LED package is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.