Patent · US Active

Flex circuit package and method

US8536462B1 · kind B1 · utility

35Cited by
153References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 22, 2010
Grant dateSep 17, 2013
Priority date
Expiry dateDec 4, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A flex circuit package includes a package body enclosing an electronic component and a first surface of the substrate. Columns are physically and electrically connected to first traces of the substrate, the columns extending through the package body. A flexible circuit connector has first terminals connected to the columns. The flexible circuit connector further includes second terminals that provide an electrical interconnection structure for electrical connection to a second electronic component structure. By connecting the flexible circuit connector to the columns extending through the package body, special routing of traces of the substrate of the flex circuit package to provide an interface for the flexible circuit connector is avoided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.