Patent · US Active

Supply voltage or ground connections for integrated circuit device

US8536716B1 · kind B1 · utility

2Cited by

4References

26Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Mostafa Naguib Abdulla · Rancho Cordova, US
Steven Eskildsen · Boise, US

Key dates

Filing date	Dec 31, 2009
Grant date	Sep 17, 2013
Priority date	—
Expiry date	Aug 19, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.