Integrated circuit packaging system with trenches and method of manufacture thereof
US8536718B2 · kind B2 · utility
10Cited by
20References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Sep 17, 2013 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a material layer including grooves in a fillet region that are substantially parallel and adjacent an integrated circuit; and forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.