Method for removing a part of a planar material layer and multilayer structure
US8541689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Sep 24, 2013 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.