System and method for material analysis of a microscopic element
US8546756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Oct 1, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/30455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and a method for material analysis of a microscopic element, the method comprising: illuminating an area that includes at least a portion of the microscopic element by a charged particle beam, detecting particles that are generated in the area in response to the charged particle beam and analyzing the detected particles to provide an indication about a material characteristic of the microscopic element, wherein the operation of illumination is implemented as a sequence of displacement compensation determination periods, each provided between consecutive material analysis periods, the method further comprising evaluating during a displacement compensation determination period, a displacement of the charged particle beam with respect to the microscopic element and during a consecutive material analysis period applying a spatial adjustment measure as required, thereby compensating for a drift of the charged particle beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.