Patent · US Active

Embedded integrated circuit package-on-package system

US8546929B2 · kind B2 · utility

7Cited by

9References

20Claims

0Family size

Assignee

STATS ChipPAC, Ltd. · SG

Inventors

You Yang Ong · Singapore, SG
Dioscoro A. Merilo · Singapore, SG
Seng Guan Chow · Singapore, SG

Key dates

Filing date	Apr 19, 2006
Grant date	Oct 1, 2013
Priority date	—
Expiry date	Oct 2, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embedded integrated circuit package-on-package system is provided forming a first integrated circuit package system, forming a second integrated circuit package system, and mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.