Method for interstitial polymer planarization using a flexible flat plate
US8556611B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2011 |
| Grant date | Oct 15, 2013 |
| Priority date | — |
| Expiry date | Sep 17, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.