Inventor · Victor, NY, US

Gary D. Redding

39Patents
3h-index
45Co-inventors
63Inventor score

Filing activity: Sep 30, 1999 → Sep 10, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US6229114A Precision laser cutting of adhesive members Performing Operations; Transporting 106 Expired
US8556611B2 Method for interstitial polymer planarization using a flexible flat plate Performing Operations; Transporting 7 Active
US9757900B2 Pin-actuated printhead Performing Operations; Transporting 6 Active
US8708465B1 Method for protecting piezoelectric transducer Performing Operations; Transporting 3 Active
US8608293B2 Process for adding thermoset layer to piezoelectric printhead Emerging Cross-Sectional Technologies 3 Active
US10134793B1 Method of forming two-dimensional and three-dimensional semiconductor chip arrays Electricity 2 Active
US8585187B2 High density electrical interconnect for printing devices using flex circuits and dielectric underfill Emerging Cross-Sectional Technologies 2 Active
US7014527B2 Die level testing using machine grooved storage tray with vacuum channels Physics 2 Expired
US9139004B2 Print head transducer dicing directly on diaphragm Emerging Cross-Sectional Technologies 2 Active
US8550601B2 Use of photoresist material as an interstitial fill for PZT printhead fabrication Emerging Cross-Sectional Technologies 1 Active
US9238365B1 Flex circuit board with topographical structures to facilitate fluid flow through the layer Performing Operations; Transporting 1 Active
US10629515B2 System and method for cooling digital mirror devices Physics 1 Active
US9168747B2 Multi-layer electroformed nozzle plate with attenuation pockets Emerging Cross-Sectional Technologies 1 Active
US8984752B2 Printhead fabrication using additive manufacturing techniques Emerging Cross-Sectional Technologies 1 Active
US7207442B2 Die storage tray having machined grooves and vacuum channels Emerging Cross-Sectional Technologies 1 Expired
US11383417B2 Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers Performing Operations; Transporting 0 Active
US10252525B2 Lead-free piezo printhead using thinned bulk material Chemistry; Metallurgy 0 Active
US7823266B2 Method for manufacturing a die storage tray having machined grooves and vacuum channels Emerging Cross-Sectional Technologies 0 Active
US9802408B2 Raised fluid pass-through structure in print heads Performing Operations; Transporting 0 Active
US11025796B2 Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays Emerging Cross-Sectional Technologies 0 Active
US9321265B2 Electrostatic actuator with short circuit protection and process Performing Operations; Transporting 0 Active
US9073321B1 Printhead layer design for compatibility with wet adhesive application processes Performing Operations; Transporting 0 Active
US9931843B2 Raised fluid pass-through structure in print heads Performing Operations; Transporting 0 Active
US8814328B2 Polymer film as an interstitial fill for PZT printhead fabrication Emerging Cross-Sectional Technologies 0 Active
US12122178B2 Imaging blanket and variable data lithography system employing the imaging blanket Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.