Boron film interface engineering
US8563090B2 · kind B2 · utility
3Cited by
18References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2009 |
| Grant date | Oct 22, 2013 |
| Priority date | — |
| Expiry date | Jan 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76237
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of depositing boron-containing liner layers on substrates involve the formation of a bilayer including an initiation layer which includes barrier material to inhibit the diffusion of boron from the bilayer into the underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.