Inventor · Fremont, CA, US

Derek R. Witty

39Patents
11h-index
78Co-inventors
78Inventor score

Filing activity: Nov 18, 1996 → Jun 28, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US7018941B2 Post treatment of low k dielectric films Electricity 648 Expired
US8445075B2 Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics Electricity 500 Active
US8138104B2 Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure Electricity 458 Active
US6465051B1 Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling Electricity 191 Expired
US7871926B2 Methods and systems for forming at least one dielectric layer Electricity 77 Active
US7112541B2 In-situ oxide capping after CVD low k deposition Electricity 56 Expired
US6413871B1 Nitrogen treatment of polished halogen-doped silicon glass Electricity 25 Expired
US9721784B2 Ultra-conformal carbon film deposition Electricity 23 Active
US7670924B2 Air gap integration scheme Emerging Cross-Sectional Technologies 17 Active
US8148269B2 Boron nitride and boron-nitride derived materials deposition method Electricity 16 Active
US7425716B2 Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beam Electricity 11 Active
US7166544B2 Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors Electricity 8 Expired
US7611996B2 Multi-stage curing of low K nano-porous films Emerging Cross-Sectional Technologies 7 Expired
US7790635B2 Method to increase the compressive stress of PECVD dielectric films Electricity 7 Active
US7867578B2 Method for depositing an amorphous carbon film with improved density and step coverage Electricity 6 Active
US8679987B2 Deposition of an amorphous carbon layer with high film density and high etch selectivity Electricity 6 Active
US10074534B2 Ultra-conformal carbon film deposition Electricity 5 Active
US8586487B2 Low temperature plasma enhanced chemical vapor deposition of conformal silicon carbon nitride and silicon nitride films Electricity 5 Active
US8337950B2 Method for depositing boron-rich films for lithographic mask applications Electricity 5 Active
US7547643B2 Techniques promoting adhesion of porous low K film to underlying barrier layer Electricity 4 Expired
US8084105B2 Method of depositing boron nitride and boron nitride-derived materials Chemistry; Metallurgy 4 Active
US8389376B2 Air gap integration scheme Emerging Cross-Sectional Technologies 4 Active
US7816205B2 Method of forming non-volatile memory having charge trap layer with compositional gradient Electricity 4 Active
US7704816B2 Boron derived materials deposition method Electricity 4 Active
US8758638B2 Copper oxide removal techniques Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.