Patent · US Active

Method for producing a micromechanical component having a trench structure for backside contact

US8564078B2 · kind B2 · utility

0Cited by

5References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Roland Scheuerer · Reutlingen, DE
Heribert Weber · Leverkusen, DE
Eckhard Graf · Gomaringen, DE

Key dates

Filing date	Nov 8, 2011
Grant date	Oct 22, 2013
Priority date	—
Expiry date	Nov 8, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/481
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate. In addition, an insulating layer and a filler layer are produced or applied on a first side of the substrate. The filler layer comprises a filler material that substantially fills up the trench structure. A planar first side of the substrate is produced by way of a subsequent planarization within a plane of the filler layer or of the insulating layer or of the substrate. A further planarization of the second side of the substrate is then accomplished. A micromechanical component that is manufactured in accordance with the method is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.