Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
US8569882B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Apr 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.