System and method to reduce pre-back-grinding process defects
US8571699B2 · kind B2 · utility
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6References
20Claims
0Family size
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Key dates
| Filing date | Sep 10, 2010 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.