Wafer inspection system and a method for translating wafers
US8573077B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2012 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Oct 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.