Semiconductor chip device with liquid thermal interface material
US8574965B2 · kind B2 · utility
4Cited by
2References
23Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 22, 2010 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Oct 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.